EN
"In our factory, quality is the baseline, not a feature. We obsess over 3mil traces and BGA soldering so you don't have to. We sell the peace of mind that your production line will never stop."
| Technical Feature | Standard Capability | Advanced Capability (High-End) |
|---|---|---|
| Layer Count | 2 - 12 Layers | Up to 36 Layers (Complex Rigid-Flex) |
| Material Types | FR4 High TG (IT180/S1000) | Rogers, Arlon, Isola, PTFE, Aluminum |
| Min. Trace / Space | 3mil / 3mil (0.075mm) | 2mil / 2mil (0.05mm) |
| HDI Tech | 1+N+1 | Any Layer HDI (1-6 Stages) |
| Max Copper Weight | 1oz - 3oz | Inner 6oz / Outer 8oz (Heavy Copper) |
| Min. Mech Drill | 0.2mm (8mil) | 0.15mm (6mil) |
| Laser Drill | 0.1mm (4mil) | 0.075mm (3mil) |
| Aspect Ratio | 8:1 | 14:1 (Thick Board Support) |
| Via Technology | Tented Vias | VIPPO (Via-in-Pad), Resin Plugged, Blind/Buried |
| Impedance Control | ±10% | ±5% (High Precision) |
| Surface Finish | HASL, ENIG, OSP | Hard Gold, Immersion Silver/Tin, ENEPIG |
