Quality shouldn't be a feature; it's the baseline. At PSCPCB, we obsess over 3mil traces, blind vias, and impedance control so you don't have to. We deliver the peace of mind that your assembly line will never stop.
| Technical Feature | Standard Capability | Advanced Capability (High-End) |
|---|---|---|
| Layer Count | 1 - 40 Layers | Up to 36 Layers (Complex Rigid-Flex) |
| Material Types | FR4 High TG (IT180/S1000) | Rogers, Arlon, Isola, PTFE, Aluminum |
| Min. Trace / Space | 3mil / 3mil (0.075mm) | 2mil / 2mil (0.05mm) |
| HDI Tech | 1+N+1 | Any Layer HDI (1-6 Stages) |
| Max Copper Weight | 1-4 oz Inner | 6oz / Outer 8oz (Heavy Copper) |
| Min. Mech Drill | 0.2mm (8mil) | 0.15mm (6mil) |
| Laser Drill | 0.1mm (4mil) | 0.075mm (3mil) |
| Aspect Ratio | 8:01:00 | 14:1 (Thick Board Support) |
| Via Technology | Tented Vias | VIPPO (Via-in-Pad), Resin Plugged, Blind/Buried |
| Impedance Control | ±10% | ±5% (High Precision) |
| Surface Finishes | HASL, ENIG, OSP | Hard Gold, Immersion Silver/Tin, ENEPIG |
