From rapid prototyping to mass production.
| Technical Feature | Standard Capability | Advanced Capability (High-End) |
|---|---|---|
| Layer Count | 1 - 40 Layers | Up to 36 Layers (Complex Rigid-Flex) |
| Material Types | FR4 High TG (IT180/S1000) | Rogers, Arlon, Isola, PTFE, Aluminum |
| Min. Trace / Space | 3mil / 3mil (0.075mm) | 2mil / 2mil (0.05mm) |
| HDI Tech | 1+N+1 | Any Layer HDI (1-6 Stages) |
| Max Copper Weight | 1-4 oz Inner | 6oz / Outer 8oz (Heavy Copper) |
| Min. Mech Drill | 0.2mm (8mil) | 0.15mm (6mil) |
| Laser Drill | 0.1mm (4mil) | 0.075mm (3mil) |
| Aspect Ratio | 8:01:00 | 14:1 (Thick Board Support) |
| Via Technology | Tented Vias | VIPPO (Via-in-Pad), Resin Plugged, Blind/Buried |
| Impedance Control | ±10% | ±5% (High Precision) |
| Surface Finishes | HASL, ENIG, OSP | Hard Gold, Immersion Silver/Tin, ENEPIG |
Layers: 1-10 (Flex) / 2-20 (Rigid-Flex)
Structure: Air-gap / Bookbinder Tech
Min Bend Radius: 6x - 10x Thickness
Material: DuPont Pyralux / Panasonic Felios
Max Copper: Inner 8oz / Outer 15oz
Differential Etching
Min Trace/Space: 8mil / 10mil (for >3oz)
Capability: High Current (100A+) & Heat Dissipation
Base Material: Aluminum / Copper / Iron
Thermal Cond.: 1W - 8W/m.k (High Performance)
Dielectric Thickness: 75μm - 150μm
Breakdown Voltage: > 3000V (Hi-Pot Tested)
Stack-up Model:4L-1.6mm
Total Thickness:1.6mm ±10%
Material:FR4 TG150
Impedance:None (Standard)
Stack-up Model: 6L-1.6mm
Total Thickness: 6L-1.6mm ±10%
Material: IT180A (High TG)
Impedance: 90Ω / 100Ω Differential (USB/Ethernet)
50Ω Single Ended (RF/Clock)
Calculation Tool:Polar Si9000
SStructure:1+N+1 (HDI Type I)
Microvia Size:4mil (0.1mm) Laser Drill
Min Trace/Space:3/3mil0
Application:BGA Pitch 0.4mm
Note:Blind & Buried Vias included
From prototype to mass production. SMT assembly and X-Ray testing under one roof.
Min Chip: 01005 / 0201
BGA Pitch: 0.25mm
Solder: Alpha / Senju
AOI + X-Ray (100%)
Conformal Coating
Download our full capability specs and DFM guidelines to optimize your layout.
