EN
From rapid prototyping to mass production. We bridge the gap between "Standard" and "Impossible".
| Technical Feature | Standard Capability | Advanced Capability (High-End) |
|---|---|---|
| Layer Count | 2 - 12 Layers | Up to 36 Layers (Complex Rigid-Flex) |
| Material Types | FR4 High TG (IT180/S1000) | Rogers, Arlon, Isola, PTFE, Aluminum |
| Min. Trace / Space | 3mil / 3mil (0.075mm) | 2mil / 2mil (0.05mm) |
| HDI Tech | 1+N+1 | Any Layer HDI (1-6 Stages) |
| Max Copper Weight | 1oz - 3oz | Inner 6oz / Outer 8oz (Heavy Copper) |
| Min. Mech Drill | 0.2mm (8mil) | 0.15mm (6mil) |
| Laser Drill | 0.1mm (4mil) | 0.075mm (3mil) |
| Aspect Ratio | 8:1 | 14:1 (Thick Board Support) |
| Via Technology | Tented Vias | VIPPO (Via-in-Pad), Resin Plugged, Blind/Buried |
| Impedance Control | ±10% | ±5% (High Precision) |
| Surface Finish | HASL, ENIG, OSP | Hard Gold, Immersion Silver/Tin, ENEPIG |
Layers: 1-10 (Flex) / 2-20 (Rigid-Flex)
Structure: Air-gap / Bookbinder Tech
Min Bend Radius: 6x - 10x Thickness
Material: DuPont Pyralux / Panasonic Felios
Layers: 1-10 (Flex) / 2-20 (Rigid-Flex)
Structure: Air-gap / Bookbinder Tech
Min Bend Radius: 6x - 10x Thickness
Material: DuPont Pyralux / Panasonic Felios
Layers: 1-10 (Flex) / 2-20 (Rigid-Flex)
Structure: Air-gap / Bookbinder Tech
Min Bend Radius: 6x - 10x Thickness
Material: DuPont Pyralux / Panasonic Felios
Stack-up Model: 4L-1.6mm
Total Thickness: 1.6mm ±10%
Material: FR4 TG170
Impedance: Diff 100Ω / SE 50Ω
Stack-up Model: 4L-1.6mm
Total Thickness: 1.6mm ±10%
Material: FR4 TG170
Impedance: Diff 100Ω / SE 50Ω
Stack-up Model: 4L-1.6mm
Total Thickness: 1.6mm ±10%
Material: FR4 TG170
Impedance: Diff 100Ω / SE 50Ω
From prototype to mass production. SMT assembly and X-Ray testing under one roof.
Min Chip: 01005 / 0201
BGA Pitch: 0.25mm
Solder: Alpha / Senju
AOI + X-Ray (100%)
Conformal Coating
Download our full capability specs and DFM guidelines to optimize your layout.
